As the proliferation of smarter systems and advanced wireless networks pushes semiconductor industry innovation to new heights, engineers are testing increasingly complex and feature-rich ICs while continually being pressured to meet tight deadlines and cost targets. Come learn how industry leaders are addressing the latest test challenges for RF and mixed-signal ICs using new solutions for semiconductor test.
Semiconductor Technical Sessions
A full conference pass is required to attend these and other technical sessions.
Wednesday, 20 November 2019
|10:45||Coffee Break - Exhibition|
Addressing Market Changes in Semiconductor Test With STS
David Hall - NATIONAL INSTRUMENTS
NI is making substantial progress in helping customers leverage key investments in lab characterization to achieve shorter time to production test in high-volume manufacturing. Discover why customers are adopting the NI Semiconductor Test System (STS), hear about their successes, and learn about the role of STS Specialty partners.
Significantly Reducing Characterization Timelines by Globally Standardizing on a Common Approach
Wouter Janssens, MELEXIS
In 2014, Melexis decided to drastically change our way of performing characterization by moving away from using a rack-and-stack approach. As a growing company, we needed to optimize our approach and reduce the time we spend on characterizing our products. In this session, learn how we successfully made such a significant change and what results and benefits we have seen, and how we are working to keep the standardization in place and evolve it over time.
How to Succeed (and Fail) at Bridging Validation and Production Test
John Bongaarts - NATIONAL INSTRUMENTS
The ability to meet time-to-market targets is key for a chipmaker to be competitive. Many have attempted to condense schedules and improve execution while maintaining quality by looking for gains across first silicon bring-up, characterization, and production test. Explore the successes and failures in these attempts and address their common traits.
Performing Pattern Validation and Failure Analysis Without Using Traditional ATE
Tobias Graf, TEXAS INSTRUMENTS
Traditional automated test equipment (ATE) typically has been used to debug and validate patterns before using them in production, as well as for performing failure analysis. Texas Instruments has found a more cost-effective and agile approach. During this session, learn about our past way of working, the reasons for changing that approach, and the benefits we have seen from the new method.
Coffee Break - Exhibition
Reducing the Cost of Built-In Self-Test (BIST) Validation
Amine Ltaief and Philippe Cavallera, STMICROELECTRONICS
At STMicro, we take advantage of BIST to undertake characterization and production test of microcontrollers, including the increasingly important analog features. Our SoftBIST solution is loaded at runtime - it is capable of highly flexible input parameters, with results retrieved as a contextual output from the device. Traditionally, validation of the BIST requires expensive time on production test ATE systems. As a result, it is not always possible to achieve 100% validation coverage, due to a lack of automation. This can lead to expensive problems being discovered once a device is in production. In the session we will show how we overcame these challenges in the lab by using PXI (Including the NI Digital Pattern Instrument and NI Source Measure Unit) and NI TestStand.
Improving the Semiconductor Design to Test Workflow
George Zafiropoulos, NATIONAL INSTRUMENTS
NI is partnering with semiconductor design tools technology leaders to improve the overall flow from product concept to production. Learn from NI and Cadence Design Systems about semiconductor data management and analysis tools. Also discover the benefits of building linkages between pre- silicon design verification and test platforms.
Thursday, 21 November 2019
|10:45||Coffee Break - Exhibition|
Semiconductor innovation for smart connected devices – from components to full system solutions
Lars Reger, NXP
Semiconductor innovation has stepped up to a new level of complexity. With IoT and Automotive eco-systems evolving towards ever higher standards in sustainability, automation, and connectivity, the market is asking for easy-to-implement, scalable system solutions, rather than individual components. Safety and security by design is seen as the foundation of this evolution. At the same time, quality requirements are being tightened, moving towards true zero defect. This demands for a different view on the development process for ICs, moving beyond traditional approaches. In this session you will hear NXP’s vision on today’s and future system solutions and learn how the company is dealing with these consequences of a rapidly changing market environment.
Leveraging scalable ATE platform for RF WLCSP with NI STS
Erwin Platter, NXP
Within the product line Smart Antenna Solutions at NXP we strive for leading edge RF device performance at lowest cost of test. Traditional ATE have always had challenges meeting our RF needs out of the box. In this session we will discuss how we could gradually moved from what we had to what we needed, scaling up from PXI to augment ATE to STS T2 and finally now STS T4 for RF WLCSP test.We will cover topics like prober compatibility between T2 and T4 and how our product engineers with help from NI are able to contribute to test developments helping us accelerate time to market.
Mark Gallagher, Grand Prix Motor Racing executive
Abstract will follow soon
Challenges and Solutions for mmWave OTA Test
Mher Minasyan, NATIONAL INSTRUMENTS
The 5G industry is seeing more semiconductor devices that operate above 24 GHz, many of which are integrated antenna-in-package (AiP) units that require over-the-air (OTA) test. Learn about the characteristics and challenges of OTA test and the current solutions for fast OTA characterization and manufacturing test.
Successful Semiconductor Wafer Probe Test Solutions for mmWave Production
Arne Holland, FORMFACTOR INC
Semiconductor wafer probe test requires several elements to be successful. In this session, explore the requirements for the growing RF and mmWave device test applications. Topics include performance requirement trade-offs for cost effective production, probe card design, direct dock interfacing, calibration, and other setup considerations.
Coffee Break - Exhibition
Challenges in electrical testing of MEMS Sensors
Dennis Alveringh and Armando Fernandez, SALLAND ENGINEERING
By definition, MEMS chips consist of mechanical structures to sense or actuate a physical quantity in its environment. The readout structures that translate the mechanical movement to an electrical signal are often capacitive. Although most automatic testing equipment are able to measure static capacitance, sampling a varying capacitance at high accuracy and high frequency is a totally different story. Meet the challenges in designing a varying capacitance meter for fully electrical MEMS testing. And find out how we integrate this into a practical PXI based solution.
Achieving Highly Effective Test Flows for MEMS Test with NI PXI-Based ATE
Ari Kuukkala and Markku Sirén, AFORE OY
Chip-scale-packaging (CSP) technologies are gaining popularity for microelectromechanical systems (MEMS), but engineers with traditional test systems are challenged by the small size of the sensor and constant pressure to reduce costs. They need solutions that can test and calibrate the sensor with real stimuli at high accuracies. Learn how we build such a solution by integrating the NI PXI platform into a handler.